Shiny Li
Jan 28,2016
676
Insulation Resistance
The electrical resistance of the insulating material (determined under specified conditions) between any pair of contacts, conductors, or grounding device in various combinations. The electrical...
Shiny Li
Jan 28,2016
715
Inspection Overlay
A positive or negative transparency made from the production master and used as an inspection aid.
Shiny Li
Jan 28,2016
584
Inspection Lot
A collection of units of products bearing identification and treated as a unique entity from,which a sample is to be drawn and inspected to determine conformance with the acceptability criteria. ...
Shiny Li
Jan 28,2016
602
INDEX EDGE
INDEX EDGE MARKER, INDEXING HOLE, INDEXING NOTCH, INDEXING SLOT: See Locating Edge, Location Edge Marker,etc.
Shiny Li
Jan 28,2016
1149
Inclusion
A foreign particle in the conductive layer, plating, or base material.
Shiny Li
Jan 28,2016
651
In-circuit Test
A check of specific components(s) or cuicuits(s) within an assembly without their de-coupling from the primary circuit.
Shiny Li
Jan 28,2016
835
Impedance, Characteristic
The resistance of a parallel conductor structure to the flow of alternating current (ac), usually applied to high-speed circuits and normally consisting of a constant value over a wide range of freque...
Shiny Li
Jan 28,2016
671
Immersion Plating
The chemical deposition of a thin metallic coating over certain basis metals that is achieved by a partial displacement of the basis metal.
Shiny Li
Jan 28,2016
671
Hygroscopic
The ability of a material to absorb and retain moisture from the air.
Shiny Li
Jan 28,2016
782
Hot Zone
The section of a re-flow oven held at maximum temperature. Other zones include per-heat and cooling.
Shiny Li
Jan 28,2016
651
Hole Void
A void in the metallic deposit of a plated through-hole exposing the base material.
Shiny Li
Jan 28,2016
833
Hole Pull Strength
The force necessary to rupture a plated through-hole when loaded or pulled in the direction of the axis of the hole.
Shiny Li
Jan 28,2016
865
Hole Location
The dimensional location of the centre of a hole.
Shiny Li
Jan 28,2016
795
Hole Density
The quantity of holes in a printed circuit board per unit area.
Shiny Li
Jan 28,2016
960
Hole Breakout
A condition in which a hole is not completely surrounded by the land.
Shiny Li
Jan 28,2016
718
Hipot Test
Wherein the assembly or component undergoes a high potential (ac) current.
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 4 |
| 2 | KhronoSound Audio | 1 |
