Shiny Li
Jan 28,2016
851
Muffle
An enclosure that is located between the heating elements and the parts being processed that contains the atmosphere required for the re-flow soldering process.
Shiny Li
Jan 28,2016
1015
Mounting Hole
A hole used for the mechanical mounting of a printed board or for the mechanical attachment of components to the printed board .
Shiny Li
Jan 28,2016
787
Mother Board
Also called back plane, or matrix board. A relatively large printed circuit board on which modules, connectors, sub-assemblies or other printed circuit boards are mounted and inter connections made by...
Shiny Li
Jan 28,2016
735
Module
A separable unit in a packaging scheme displaying regularity of dimensions.
Shiny Li
Jan 28,2016
875
Modifier
A chemically inert substance added to a resin to change its properties.
Shiny Li
Jan 28,2016
721
Mixed Component-Mounting Technology
A component mounting technology that uses both through-hole and surface-mounting technologies on the same packaging and interconnecting structure.
Shiny Li
Jan 28,2016
815
Mis-registration
The lack of dimensional conformity between successively produced features or terns.
Shiny Li
Jan 28,2016
777
Minor Defect
A defect which is not likely to reduce the usability of the unit for its intended purpose, It may be a departure from established standard having no significant bearing on the effective use or operati...
Shiny Li
Jan 28,2016
999
Minimum Electrical Spacing
The minimum allowable distance between adjacent conductors that is sufficient to prevent dielectric breakdown, between the conductors at any given voltage.
Shiny Li
Jan 28,2016
902
Mil
One thousandth (0.001) of an inch. Not to be confused with Mil (short for millimetre).1Inch=25.4mm; 1mil=0.0254mm.
Shiny Li
Jan 28,2016
990
Micro-strip
A type of transmission line configuration which consists of a conductor over a parallel ground plane, and separated by a dielectric.
Shiny Li
Jan 28,2016
823
Micro-sectioning
A destructive test procedure in which a section of specimen it cut and removed for close examination.
Shiny Li
Jan 28,2016
876
Metallization
A deposited or plated thin metallic film used for its protective or electrical properties.
Shiny Li
Jan 28,2016
792
Metal Clad Base Material
Base material covered with metal on one or both of its sides.
Shiny Li
Jan 28,2016
1900
Meniscus
The contour or shape of molten solder as formed by surface tension forces in turn controlled by wetting.
Shiny Li
Jan 28,2016
706
Melting Range
The temperature range over which the solder alloy melts .An alloy with a single melting point, rather than a melting range, is known as a eutectic alloy .
Shiny Li
Jan 28,2016
980
MELF
A metal electrode leadless face surface mount component that is round with metallic cap terminations.
Shiny Li
Jan 28,2016
1144
Measling
A condition existing in the base laminate in the form of discrete white sports or crosses below the surface of the base laminate, reflecting a separation of fibres in the glass cloth at the weave inte...
Shiny Li
Jan 28,2016
1087
Mean Time between Failure (MTBF)
The statistical mean average time interval, usually in hours, that may be expected between failures of an operating unit. Results should be designated actual. Predicted or calculated.
Shiny Li
Jan 28,2016
848
MCR
Moulded Carrier Ring. A tape of fine-pitch chip package named for the method of supporting and protecting the leads. The leads are left straight; the ends of the leads are embedded in a strip of plast...
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 11 |
| 2 | KhronoSound Audio | 2 |
| 3 | john James | 1 |
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| 5 | LouD _ | 1 |
