Shiny Li
Jan 20,2016
700
Conductor Thickness
The thickness of the conductor at any point chosen at random on the printed board, normally viewed from vertically above unless otherwise specified.
Shiny Li
Jan 20,2016
706
Conductor Spacing
The average or minimum (as specified) distance between the adjacent edges of conductors on the same layer of a printed board.
Shiny Li
Jan 20,2016
823
Conductor Side
The side of a single-sided printed board containing the conductive pattern.
Shiny Li
Jan 20,2016
622
Conductor Layer
The total conductive pattern formed upon one side of a single layer of base material.
Shiny Li
Jan 20,2016
669
Conductor Base width
The conductor width at the plane of the surface of the base material. See also: Conductor width.
Shiny Li
Jan 20,2016
678
Conductive Pattern
The configuration or design of the conductive material on the base laminate. Includes conductors, lands, and through connections.
Shiny Li
Jan 20,2016
795
Conductive Foil
A thin sheet of metal that may cover one or both sides of the base material and is intended to form the conductive pattern.
Shiny Li
Jan 20,2016
656
Conductive Adhesive
A material to which metal particles (usually silver ) are added to increase electrical conductivity.
Shiny Li
Jan 20,2016
616
Component
Any of the basic parts used in building electronic equipment, such as a resistor, capacitor, DIP or connector, etc.
Shiny Li
Jan 20,2016
595
Component side
(Primary side) The surface layer of a board on which most of the components are placed. Component side is also referred to as the top side (layer one-counting downwards) of the board.
Shiny Li
Jan 20,2016
660
Component Hole
A hole in a PCB through-which a component lead passes in order to be soldered or connected mechanically to the printed circuit and electrically to the conductive pattern. Synonym: mounting hole....
Shiny Li
Jan 20,2016
632
Component Density
The quantity of components on a unit area of printed board.
Shiny Li
Jan 20,2016
657
Compiler
A software module that analyses and converts programs from a high-level language to binary machine codes.
Shiny Li
Jan 20,2016
813
Compatibility
In which materials can be mixed or brought into contact with no reaction or separation.
Shiny Li
Jan 20,2016
770
Cold Solder Connection
A solder connection that exhibits poor wetting and that is characterized by a greyish porous appearance.
Shiny Li
Jan 20,2016
737
Coefficient of Expansion, Thermal-CTE
The fractional change in dimension of a material for a unit change in temperature expressed in ppm/C.
Shiny Li
Jan 20,2016
1013
COB
Chip on board. Component packaging technology in which bare integrated circuits are attached directly to the surface of a substrate and interconnected to the substrate most often by means of microscop...
Shiny Li
Jan 20,2016
650
Coating
A thin layer of material, either conductive or insulating, applied over components or base materials.
Shiny Li
Jan 20,2016
818
Clinched-wire through Connection
A connection made by a wire which is passed through a hole in a printed circuit board, and subsequently formed, or clinched, in contact with the conductive pattern on each side of the board, and...
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 4 |
| 2 | Engineer | 1 |
| 3 | Ibrahim TKR | 1 |
| 4 | Engineer | 1 |
| 5 | Adilson Pierog | 1 |
| 6 | Lucas Laupichler | 1 |
