Grid
An orthogonal network of two sets of parallel, equidistant lines used for locating points on a printed circuit board.
Glob Top
A coating process in which a set portion of resin is dispensed on the top of a chip or board. After spreading over the entire surface ,it is cured to form a soild protective coating.
Class Transition Temperature
TG-value, temperature at which resin ceases to act as a solid, Till this temperature, no separation will take place between resin/copper/reinforcement.
Glass Epoxy
A material used to fabricate printed circuit boards. The base material (fibre-glass) is impregnated with an epoxy filler which then must have copper laminated to its outer surface to form the material...
Gerber
Vector-based language, developed by Gerber Scientific Instrument Company, for sending commands to photoplotters.
Fused Coating
A metallic coating, usually tin or solder alluvia, which has been melted and solidified forming a metallurgical bond to the base material.
Functional Test
To check an assembly using equipment that tests for the functions intended and engaging inputs and outputs.
Fully-Additive Process
An additive process wherein the entire thickness of electrically isolated conductors is built-up by copper.
FR4
Flame retardent laminate made from woven glass fibre material impregnated with epoxy resin.
Forced-air Convection
Convection, consisting of flow, rate, velocity and temperature, as heat transfer of fluid or gas over solder joints to be re-flowed.
Footprint
(See also Land Pattern).A set of properly sized and placed pads of a PCB on which a surface mounted component can be placed and soldered. Alternatively, the footprint is the board area occupied by a s...
Foil
A thin sheet of metal, usually copper, used as the conductor for printed circuits.
Flux-cored Solder
A wire of solder that contains one or more continuous flux-filled cavities along its length.
Flux, Activated Rosin Flux
A mixture of rosin and small amounts of organic-halide or organic-acid activator, which improves the ability of a flux to remove surface oxides from the surfaces being joined.
Flux Residue
A flux-related contaminant that is present on or near the surface after soldering and, if possible, should be washed away.
Flux
A substance used to promote or facilitate fusion, such as a material used to remove oxides from surfaces to be joined by soldering welding.
Flush Conductor
A conductor whose outer surface is in the same plane as the surface of the insulating material adjacent to the conductor.
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 6 |
| 2 | Engineer | 2 |
| 3 | Engineer | 1 |