Shiny Li
Jan 19,2016
739
Boundary Scan
A self-test designed into components at the silicon level, permitting testing via a built-in, four-or-five-pin test bus&...
Shiny Li
Jan 19,2016
590
Border Data
Patterns that appear in the border area, such as tooling features, test patterns and registration marks.
Shiny Li
Jan 19,2016
642
Bonding Time
The duration from hot-bar-heat-up (contact with lead and pad ) until the solder joint is completed.
Shiny Li
Jan 19,2016
1349
Bonding Layer
An adhesive layer used in bonding together other discrete layers of multi-layer printed board during lamination.
Shiny Li
Jan 19,2016
673
Bond Strength:
The force perpendicular to a board’s surface required to separate two adjacent layers of the board, expressed as&nb...
Shiny Li
Jan 19,2016
704
Bond Lift-off
A failure condition in which a lead is separated from its bonding surface.
Shiny Li
Jan 19,2016
601
Bond Interface
The common area between a lead and a land to which it has been terminated.
Shiny Li
Jan 19,2016
750
Body
The portion of an electronic component exclusive of its pins or leads.
Shiny Li
Jan 19,2016
710
Board Thickness
The overall thickness of the base material and all conductive materials deposited thereon.
Shiny Li
Jan 19,2016
664
Board Density
A measure of the ratio of the area of the board used by parts to the total available area of the&nbs...
Shiny Li
Jan 19,2016
893
Blutter Coat
An external layer of resin over the reinforcing structure of base material.
Shiny Li
Jan 19,2016
810
Bluetooth
Bluetooth is a short-range (up to 10m) 2.4GHz wireless connectivity standard intended for such applications as wireless&...
Shiny Li
Jan 19,2016
683
Blow Hole
A void in the solder fillet caused by outgassing from the barrel of a plated through hole.(see also outgassing...
Shiny Li
Jan 19,2016
1280
Blistering
A localized swelling and separation between any of the layers of a laminated base material, or between base ma...
Shiny Li
Jan 19,2016
790
Blister
De-lamination in the form of a localized swelling and separation between any of the Layers of a lamination bas...
Shiny Li
Jan 19,2016
883
Blind Via
A via that reaches only one layer beneath the outer layer on one side of a muti-layer board.
Shiny Li
Jan 19,2016
857
Bleeding
A condition in which liquid solder resist or rotation spreads larger than the defined apperture.
Shiny Li
Jan 19,2016
980
Biscuit Frame
An array of circuits on a larger “mother” panel.
Shiny Li
Jan 19,2016
701
BGA
Ball Grid Array. Leadless array packaging technology in which solder balls are mounted to the underside of the ...
Shiny Li
Jan 19,2016
685
Bellows Contact
A connector contact which is a flat sprint folded to provide a uniform spring rate over the full tolerance ran...
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 4 |
| 2 | KhronoSound Audio | 1 |
