Overhang
Increase in printed circuit conductor width caused by plating build-up or by undercutting during etching.
Outgrowth
The increase in conductor width at one side of a conductor, caused by plating build-up, over that delineated on the production master.
Outgassing
The gaseous emission from a laminate printed board or component when the board or the printed board assembly is exposed to heat or reduced air pressure or both.
Open
An area of a bare PCB which, due to over-etching or fabrication problems, separates two electrically connected points.
Omegameter
A test instrument measuring ionic residues on PCBs via the drop of resistivity over a specific time.
Non-wetting
A condition whereby a surface has contacted molten solder, but has had none of the solder adhere to it.
Non-polar Compound
Material having electrical charges distributed over the surface of the molecule, thereby showing an electrical effect in solution.
Non-functional Land
A land on internal or external layers, not connected to the conductive pattern on its layer.
Non-conductive Pattern
A configuration formed by functional non-conductive material of a printed circuit.
Non-conductive Epoxy
An epoxy resin with or without a filler, which may be added to improve thermal conductivity.
Non-clean solder
A process using specially formulated low-solid solder pastes whose residues require no cleaning.
Neutralizer
An alkaline chemical added to water to improve its ability to dissolve flux residues.
Netlist
A net is a junction of component nodes. A netlist is a collection of nets that define all the connections in a circuit. It is obtained automatically from a schematic capture program.
Negative–acting Resist
A resist which is polymerized (hardened) by light and which, after exposure and development remains on the surface of a laminate in those areas which were under the transparent parts of a production ,...
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