Rogers Corporation will be showing samples of the company’s wide range of industry-leading PCB materials at the Del Mar Electronics & Design Show (DMEDS), April 30-May 1, 2014, at the Del Mar Fairgrounds in San Diego, California.
Representatives from Rogers Corporation will be at booth #622 with information and insight on the use of their circuit materials, including COOLSPAN TECA film, RO4835 high-frequency laminates, and RO4360G2 high-frequency laminates.
Rogers COOLSPAN TECA film is a thermally- and electrically-conductive adhesive that is ideal for bonding circuit boards to heavy metal backplanes, heat sinks, and housings. The thermosetting, epoxy-based, silver-filled adhesive is a practical alternative to fusion bonding, sweat soldering, press-fit, and other mechanical approaches for attaching circuits to associated structures. COOLSPAN TECA film, which is supplied in sheet form on a PET carrier, is able to survive lead-free solder processing and offers outstanding chemical resistance and high-temperature performance, helping you to keep things cool.
Rogers RO4835 high-frequency laminates, specially formulated with improved oxidation resistance, were developed for applications needing improved stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. Just as with RO4350B material, RO4835 laminates offer a dielectric constant of 3.48 at 10 GHz, a low loss tangent of 0.0037 at 10 GHz, and a low z-axis coefficient of thermal expansion (CTE) for excellent plated-through-hole (PTH) reliability under a variety of processing and operating conditions. These improved oxidation resistance circuit materials exhibit x- and y-axis expansion coefficients similar to that of copper. RO4835 laminates are RoHS-compliant, do not require special preparation, and can be processed using standard fabrication methods.
RO4360G2 laminates have a tailored high Dk of 6.15 @ 10 GHz, which allows next generation power amplifier designers to meet size and cost reduction targets. Specifically, the laminate’s higher Dk allows for a significant reduction in finished circuit board size (20-30%). RO4360G2 laminates process similar to FR-4, are automated assembly compatible, and offer the same reliability and repeatability that customers have come to expect from Rogers RO4350B material.
With a UL 94V-0 flame rating and fully lead-free process capable, these laminates possess excellent thermal conductivity of .81 W/m/K for improved reliability, a low Z-axis CTE for reliable plated through holes, and drill performance as good as or better than RO4350B laminates.
