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Wind Tunnel for Thermal and Airflow Testing of Multiple PCBs

by: Dec 12,2013 664 Views 0 Comments Posted in Engineering Technical

printed circuit board three PCBs Multiple PCBs

label: Multiple PCBs,three PCBs,printed circuit board

Omega Engineering has released the new WT-3200 series of wind tunnels for thermal and airflow testing of multiple PCBs.

Featuring a 2-D converging nozzle with a multi-point measurement area for sensor placement upstream of the test section, the test chamber can accommodate up to six PCBs with 13 mm (0.5 in) card-to-card spacing or three PCBs with 25 mm (1 in) card-to-card spacing. The test chamber can be used to characterize different heat sink sizes for natural and forced convection cooling, the company said. For example, two heat sinks can be tested side by side to determine their thermal performance in the same environment. Actual or simulated PCBs can be tested for thermal flow distribution and pressure drop characterization.

The test section is made of clear polycarbonate material to accommodate smoke flow visualization and the chamber has its own stand for placement of instruments, the company said. The WT-3200 is placed on castors for ease of transportation. Rail guides are provided so the unit position can be adjusted. A switch box is provided with the unit so individual fans can be turned on or off. The WT-3200 can be fitted with different fan trays to accommodate a broad air flow range.

Source://www.seekic.com

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