A printed circuit board (pcb) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. pcb's can be single sided (one copper layer), double sided (two copper layers) or multi-layer. Conductor on different layers are connected with plated-through holes called vias. Advanced PCB's may contain components - capacitors, resistors or active devices - embedded in the substrate.
With multimedia services, including telephone, cable television (CATV), and comprehensive and rapid development of digital TV and the Internet, photoelectric PCB making video also more and more. The circuit bandwidth and capacity demand has increased dramatically. In the traditional electrical field, signal transmission and switching speed has been limited. In the electronic computer, for example, the CPU frequency has reached 2-2.9 GHz, in major telecommunications transmission stream speed more reach dozens or even thousands of Gbit. And by contrast, computer bus transmission is still stay in 10-100 - m, but also high Gbit. Obviously, the internal bus connection and the computer interconnection rate has become the bottleneck of the entire computer environment. For a long time, someone is talking about the light as the internal computer (including internal circuit board) and computer interconnection between means. Here are some related video photoelectric PCB production.
Tell from the principle, use wire connection transmission rate by its parasitic parameters (next to the parasitic resistance, inductance, and capacitance) and the influence of the restrictions, such as the commonly used FR - 4 base material in the signal transmission rate is about 70% of the speed of light, this rate has been can't meet the requirements in many fields. And the light interconnection can overcome this situation. Photons with larger bandwidth and low transmission loss, from crosstalk and magnetic interference, in the same medium of optical transmission of multiple wavelengths, different wavelengths can be parallel. So, the photon application has played an important role in the field of electronics.
In this context, photoelectric concept of printed circuit board was proposed. In short, the photoelectric printed circuit board is to integrate, light and electricity to light signal transmission, with electricity for operation of a new generation of high operation required packaging substrate, is now developing very mature traditional printed circuit board with a light layer. Therefore makes the use of the circuit board are connected by a current electricity technology development in the field of optical transmission.
There is mentioned in front, a data transfer rate of copper wires by the influence of the parasitic resistance, inductance and capacitance parameter. At low frequencies, circuit board series resistance and bypass capacitors, had a great influence on the performance of direct decided to rise along the falling edge and the conversion time, thus affecting the data transfer rate; At high frequencies, the attachment concatenated impedance influence over the resistance, the end result the same as the concatenated resistance and bypass capacitors, limits the data transmission rate. All of these parasitic parameters largely depends on the connection geometry, resistance is proportional to the length of the attachment, inverse ratio to the cross-sectional area, so the attachment more long more fine, the data transfer rate is lower. The existing space limit will not be allowed to attachment is too coarse. Although in lower conversion time can use a hard wired, but at the same time increased the noise and power consumption, and the increase of calorific value will be difficult to control.
The photoelectric circuit board according to the present invention is a photoelectric circuit board, wherein a rigid portion where at least a conductor circuit and an insulating layer are formed and layered and one or more flex portions that are bendable are integrated, external connection portions for mounting an optical element and/or a package substrate on which an optical element is mounted are formed in above-described rigid portion, and an optical circuit is formed in at least one of above-described flex portions.
Claims:
1. A photoelectric circuit board,whereina rigid portion where at least a conductor circuit and an insulating layer are formed and layered and one or more flex portions that are bendable are integrated,external connection portions for mounting an optical element and/or a package substrate on which an optical element is mounted are formed in said rigid portion, andan optical circuit is formed in at least one of said flex portions.
2. The photoelectric circuit board according to claim 1,whereina conductor circuit and an insulating layer are formed and layered on both sides of a substrate in said rigid portion.
3. The photoelectric circuit board according to claim 2,whereinan optical waveguide in film form is an optical circuit, formed in said flex portion, and a substrate in said rigid portion.
4. The photoelectric circuit board according to claim 1,whereina conductor circuit, as well as an optical circuit, is formed in at least one of said flex portions.
5. The photoelectric circuit board according to claim 1,whereinthere are a plurality of said flex portions,an optical circuit and/or a conductor circuit are/is formed in each of the flex portions,of said flex portions, at least one flex portion comprises an optical circuit out of the optical circuit and the conductor circuit, and at least another flex portion comprises a conductor circuit out of the optical circuit and the conductor circuit.
6. The photoelectric circuit board according to claim 5,whereina flex portion in which an optical circuit is formed and a flex portion in which a conductor circuit is formed are formed in the same layer.
7. The photoelectric circuit board according to claim 1,whereina conductor circuit is formed in said flex portion, anda portion or the entirety of said conductor circuit that is formed in said flex portion is of a power supply pattern and/or a ground pattern.
8. The photoelectric circuit board according to claim 1,whereina cover lay is formed in an outermost layer in at least one side of said flex portion.
9. The photoelectric circuit board according to claim 1,whereinsaid optical circuit is an optical waveguide.
10. The photoelectric circuit board according to claim 9,whereinin said flex portion,a conductor circuit functioning as a signal pattern or a power supply pattern is formed on one side of a substrate, anda conductor circuit functioning as a ground pattern is formed on the other side of said substrate, and said optical waveguide is formed on said conductor circuit functioning as a ground pattern.
11. The photoelectric circuit board according to claim 9,whereinin said flex portion,a conductor circuit functioning as a signal pattern is formed on one side of a substrate, and a conductor circuit functioning as a ground pattern or a power supply pattern is formed by interposing an insulating layer, anda conductor circuit functioning as a ground pattern is formed on the other side of said substrate, and said optical waveguide is formed on said conductor circuit functioning as a ground pattern.
12. The photoelectric circuit board according to claim 9,whereinin said flex portion,a conductor circuit with differential line functioning as a signal pattern is formed on one side of a substrate, anda conductor circuit functioning as a ground pattern or a power supply pattern is formed on the other side of said substrate, and said optical waveguide is formed on said conductor circuit functioning as a ground pattern.
13. The photoelectric circuit board,whereina rigid portion where at least a conductor circuit and an insulating layers are formed and layered and one or more flex portions that are bendable are integrated,external connection portions for mounting an optical element and/or a package substrate on which an optical element is mounted are formed and an optical signal transmitting region is formed in said rigid portion,an optical circuit is formed in at least one of said flex portions, andsaid optical circuit is optically coupled with one end of said optical signal transmitting region of said rigid portion.
14. The photoelectric circuit board according to claim 13,whereina conductor circuit and an insulating layer are formed and layered on both sides of a substrate in said rigid portion.
15. The photoelectric circuit board according to claim 13,whereinsaid optical signal transmitting region is filled in with a resin composite.
16. The photoelectric circuit board according to claim 13,whereinsaid optical signal transmitting region is formed only of an opening.
17. The photoelectric circuit board according to claim 14,whereinsaid optical signal transmitting region is formed so as to penetrate through said substrate and all said insulating layers that configure said rigid portion.
18. The photoelectric circuit board according to claim 14,whereinsaid optical signal transmitting region is formed so as to penetrate through said substrate and a portion of said insulating layers that configure said rigid portion.
19. The photoelectric circuit board according to claim 13,whereinsaid optical signal transmitting region has a collective through hole structure or an individual through hole structure.
20. The photoelectric circuit board according to claim 15,whereinsaid resin composite has about 70%/mm or more of transmittance of a transmission light.
21. The photoelectric circuit board according to claim 13,whereina microlens is provided on an end portion on the side opposite to the side where said optical signal transmitting region is optically coupled with an optical circuit.
22. The photoelectric circuit board according to claim 21,whereinsaid microlens has about 70%/mm or more of transmittance of a transmission light.
23. The photoelectric circuit board according to claim 21,whereinsaid microlens is provided directly or by interposing an optical adhesive.
24. The photoelectric circuit board according to claim 21,whereinsaid microlens is provided by interposing a lens marker.
25. The photoelectric circuit board according to claim 13,whereinsaid optical circuit is an optical waveguide where an optical path conversion mirror is formed.
26. The device for optical communication,whereina rigid portion where at least a conductor circuit and an insulating layer are formed and layered and one or more flex portions that are bendable are integrated,an optical signal transmitting region and external connection portions for mounting an optical element and/or a package substrate on which an optical element is mounted are formed, and said optical signal transmitting region is formed in said rigid portion,said optical element and/or said package substrate are connected to said external connection portions, andan optical circuit is formed in at least one of said flex portions.
27. The device for optical communication according to claim 26,whereina conductor circuit and an insulating layer are formed and layered on both sides of a substrate in said rigid portion.
28. The device for optical communication according to claim 27,whereinan optical waveguide in film form is an optical circuit, formed in said flex portion, and a substrate in said rigid portion.
29. The device for optical communication according to claim 26,whereina conductor circuit, as well as an optical circuit, is formed in at least one of said flex portions.
30. The device for optical communication according to claim 26,whereinthere are a plurality of said flex portions, andan optical circuit and/or a conductor circuit are/is formed in each of the flex portions,of said flex portions, at least one flex portion comprises an optical circuit out of the optical circuit and the conductor circuit, and at least another flex portion comprises a conductor circuit out of the optical circuit and the conductor circuit.
31. The device for optical communication according to claim 30,whereina flex portion in which an optical circuit is formed and a flex portion in which a conductor circuit is formed are formed in the same layer.
32. The device for optical communication according to claim 26,whereina conductor circuit is formed in said flex portion, anda portion or the entirety of a conductor circuit that is formed in said flex portion is of a power supply pattern and/or a ground pattern.
33. The device for optical communication according to claim 26,whereina cover lay is formed in an outermost layer on at least one side of said flex portion.
34. The device for optical communication according to claim 26,whereinsaid optical circuit is an optical waveguide in film form.
35. The device for optical communication according to claim 34,whereinin said flex portion,a conductor circuit functioning as a signal pattern or a power supply pattern is formed on one side of a substrate, anda conductor circuit functioning as a ground pattern is formed on the other side of said substrate, and said optical waveguide is formed on said conductor circuit functioning as a ground pattern.
36. The device for optical communication according to claim 34,whereinin said flex portion,a conductor circuit functioning as a signal pattern is formed on one side of a substrate, and a conductor circuit functioning as a ground pattern or a power supply pattern is formed by interposing an insulating layer, anda conductor circuit functioning as a ground pattern is formed on the other side of said substrate, and said optical waveguide is formed on said conductor circuit functioning as a ground pattern.
37. The device for optical communication according to claim 34,whereinin said flex portion,a conductor circuit with differential line functioning as a signal pattern is formed on one side of a substrate, anda conductor circuit functioning as a ground pattern or a power supply pattern is formed on the other side of said substrate, and said optical waveguide is formed on said conductor circuit functioning as a ground pattern.
38. The device for optical communication according to claim 26,whereinthe device for optical communication is used for a cellular phone, a personal computer, a digital video camera, a digital camera, a CCD module, a liquid crystal panel, or an optical conversion module.
39. The device for optical communication according to claim 26,whereina RGB signal is transmitted through an optical circuit, and a screen adjusting signal is transmitted through a conductor circuit.
40. The device for optical communication comprising a photoelectric circuit board where a rigid portion where at least a conductor circuits and an insulating layer are formed and layered and one or more flex portions that are bendable are integrated,whereinan optical signal transmitting region and external connection portions for mounting an optical element and/or a package substrate on which an optical element is mounted are formed, and said optical signal transmitting region is formed in said rigid portion,said optical element and/or said package substrate are connected to said external connection portions,an optical circuit is formed in at least one of said flex portions, andsaid optical circuit are optically coupled with and one end of said optical signal transmitting region of said rigid portion.
41. The device for optical communication according to claim 40,whereina conductor circuit and an insulating layer are formed and layered on both sides of a substrate in said rigid portion.
42. The device for optical communication according to claim 40,whereinsaid optical signal transmitting region is filled in with a resin composite.
43. The device for optical communication according to claim 40,whereinsaid optical signal transmitting region is formed only of an opening.
44. The device for optical communication according to claim 41,whereinsaid optical signal transmitting region is formed so as to penetrate through said substrate and all said insulating layers that configure said rigid portion.
45. The device for optical communication according to claim 41,whereinsaid optical signal transmitting region is formed so as to penetrate only through said substrate and a portion of said insulating layers that configure said rigid portion.
46. The device for optical communication according to claim 40,whereinsaid optical signal transmitting region has a collective through hole structure or an individual through hole structure.
47. The device for optical communication according to claim 42,whereinsaid resin composite has about 70%/mm or more of transmittance of a transmission light.
48. The device for optical communication according to claim 40,whereina microlens is provided on an end portion on the side opposite to the side where said optical signal transmitting region is optically coupled with an optical circuit.
49. The device for optical communication according to claim 48,whereinsaid microlens has about 70%/mm or more of transmittance of a transmission light.
50. The device for optical communication according to claim 48,whereinsaid microlens is provided directly or by interposing optical adhesive.
51. The device for optical communication according to claim 48,whereinsaid microlens is provided by interposing a lens marker.
52. The device for optical communication according to claim 40,whereinsaid optical circuit is an optical waveguide where an optical path conversion mirror is formed.
53. The device for optical communication according to claim 40,whereinan optical path conversion member is provided in said photoelectric circuit board.
54. The device for optical communication according to claim 53,whereinsaid optical path conversion member is fixed to said optical element.
55. The device for optical communication according to claim 53,whereinsaid optical path conversion member is provided on said photoelectric circuit board by interposing a submount substrate.
56. The device for optical communication according to claim 53,whereinsaid optical path conversion member is fixed to the wall side of said optical signal transmitting region by interposing an adhesive.
57. The device for optical communication according to claim 53,whereinan optical path conversion mirror is formed in said optical path conversion member.
58. The device for optical communication according to claim 53,whereina convex lens or a grating lens is formed on a reflective side of said optical path conversion member.
59. The device for optical communication according to claim 55,whereinusing an optical adhesive layer, an optical path conversion member is fixed on the side opposite to the side of said submount substrate where an optical element is mounted, andsaid submount substrate is mounted on said photoelectric circuit board by interposing solder.
Description:
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001]This application relates to JP-A 2006-140233 published on Jun. 1, 2006. The contents of this application are incorporated herein by reference in their entirety.
BACKGROUND OF THE INVENTION
[0002]1. Field of the Invention
[0003]The present invention relates to a photoelectric circuit board and a device for optical communication.
[0004]2. Discussion of the Background
[0005]To meet the miniaturization needs of device applications, a flex-rigid substrate has been conventionally used in an electric device such as personal computers, digital video cameras, digital cameras, CCD modules, liquid crystal panels and optical conversion modules.
[0006]Various kinds of flex-rigid substrates to be used in electric devices of this kind have been proposed (for example, see JP-A 06-268339).
[0007]Moreover, a larger data processing capacity and a faster data processing capacity have been demanded for the above-described devices as a result of a much improved performance and multifunction capability.
[0008]The contents of JP-A H06-268339 are incorporated herein by reference in their entirety.
SUMMARY OF THE INVENTION
[0009]A photoelectric circuit board according to a first aspect of the present invention is a photoelectric circuit board, wherein a rigid portion where at least a conductor circuit and an insulating layer are formed and layered and one or more flex portions that are bendable are integrated, external connection portions for mounting an optical element and/or a package substrate on which an optical element is mounted are formed in the above-described rigid portion, and an optical circuit is formed in at least one of the above-described flex portions.
[0010]In the photoelectric circuit board according to the first aspect of the present invention, a conductor circuit and an insulating layer are desirably formed and layered on both sides of a substrate in the above-described rigid portion.
[0011]In the photoelectric circuit board according to the first aspect of the present invention, an optical waveguide in film form is desirably an optical circuit, formed in the above-described flex portion, and a substrate in the above-described rigid portion.
[0012]In the photoelectric circuit board according to the first aspect of the present invention, a conductor circuit, as well as an optical circuit, is desirably formed in at least one of the above-described flex portions.
[0013]Desirably, the photoelectric circuit board according to the first aspect of the present invention has a plurality of the above-described flex portions, an optical circuit and/or a conductor circuit are/is formed in each of the flex portions. Of the above-described flex portions, at least one flex portion comprises an optical circuit out of the optical circuit and the conductor circuit, and at least another flex portion comprises a conductor circuit out of the optical circuit and the conductor circuit.
[0014]In this case, a flex portion in which the optical circuit is formed and a flex portion in which the conductor circuit is desirably formed are formed in the same layer.
[0015]In the photoelectric circuit board according to the first aspect of the present invention, a conductor circuit is formed in the above-described flex portion, and a portion or the entirety of the above-described conductor circuit that is formed in the above-described flex portion is desirably of a power supply pattern and/or a ground pattern.
[0016]In the photoelectric circuit board according to the first aspect of the present invention, a cover lay is desirably formed in an outermost layer in at least one side of the above-described flex portion.
[0017]In the photoelectric circuit board according to the first aspect of the present invention, the above-described optical circuit is desirably an optical waveguide.
[0018]Then, in the above-described flex portion, desirably, a conductor circuit functioning as a signal pattern or a power supply pattern is formed on one side of a substrate, and a conductor circuit functioning as a ground pattern is formed on the other side of the above-described substrate, and the above-described optical waveguide is formed on the above-described conductor circuit functioning as a ground pattern.
[0019]In addition, in the above-described flex portion, desirably, a conductor circuit functioning as a signal pattern is formed on one side of a substrate, and a conductor circuit functioning as a ground pattern or a power supply pattern is formed by interposing an insulating layer, and a conductor circuit functioning as a ground pattern is formed on the other side of the above-described substrate, and the above-described optical waveguide is formed on the above-described conductor circuit functioning as a ground pattern.
[0020]In addition, in the above-described flex portion, desirably, a conductor circuit with differential line functioning as a signal pattern is formed on one side of a substrate, and a conductor circuit functioning as a ground pattern or a power supply pattern is formed on the other side of the above-described substrate, and the above-described optical waveguide is formed on the above-described conductor circuit functioning as a ground pattern.
[0021]A photoelectric circuit board according to a second aspect of the present invention is a photoelectric circuit board, wherein a rigid portion where at least a conductor circuit and an insulating layers are formed and layered and one or more flex portions that are bendable are integrated, external connection portions for mounting an optical element and/or a package substrate on which an optical element is mounted are formed and an optical signal transmitting region is formed in the above-described rigid portion, an optical circuit is formed in at least one of the above-described flex portions, and the above-described optical circuit is optically coupled with one end of the above-described optical signal transmitting region of the above-described rigid portion.
[0022]In the above-described rigid portion of the photoelectric circuit board according to the second aspect of the present invention, a conductor circuit and an insulating layer are desirably formed and layered on both sides of a substrate.
[0023]In the photoelectric circuit board according to the second aspect of the present invention, the above-described optical signal transmitting region is desirably filled in with a resin composite or formed only of an opening.
[0024]In the photoelectric circuit board according to the second aspect of the present invention, the above-described optical signal transmitting region is desirably formed so as to penetrate through the above-described substrate and all the above-described insulating layers that configure the above-described rigid portion or so as to penetrate through the above-described substrate and a portion of the above-described insulating layers that configure the above-described rigid portion.
[0025]In the photoelectric circuit board according to the second aspect of the present invention, the above-described optical signal transmitting region desirably has a collective through hole structure or an individual through hole structure.
[0026]In the photoelectric circuit board according to the second aspect of the present invention, the above-described resin composite desirably has about 70%/mm or more of transmittance of a transmission light.
[0027]In the photoelectric circuit board according to the second aspect of the present invention, a microlens is desirably provided on an end portion on the side opposite to the side where the above-described optical signal transmitting region is optically coupled with an optical circuit.
Here, the above-described microlens desirably has about 70%/mm or more of transmittance of a transmission light.
[0028]In the photoelectric circuit board according to the second aspect of the present invention, the above-described microlens is desirably provided directly or by interposing an optical adhesive.
[0029]In addition, the above-described microlens is desirably provided by interposing a lens marker.
[0030]In the photoelectric circuit board according to the second aspect of the present invention, the above-described optical circuit is desirably an optical waveguide where an optical path conversion mirror is formed.
[0031]A device for optical communication according to a first aspect of the present invention is a device for optical communication, wherein a rigid portion where at least a conductor circuit and an insulating layer are formed and layered and one or more flex portions that are bendable are integrated, an optical signal transmitting region and external connection portions for mounting an optical element and/or a package substrate on which an optical element is mounted are formed, and the above-described optical signal transmitting region is formed in the above-described rigid portion, the above-described optical element and/or the above-described package substrate are connected to the above-described external connection portions, and an optical circuit is formed in at least one of the above-described flex portions.
[0032]In the above-described rigid portion of the device for optical communication according to the first aspect of the present invention, a conductor circuit and an insulating layer are desirably formed and layered on both sides of a substrate.
[0033]In the device for optical communication according to the first aspect of the present invention, an optical waveguide in film form is desirably an optical circuit, formed in the above-described flex portion, and a substrate in the above-described rigid portion.
[0034]In the device for optical communication according to the first aspect of the present invention, a conductor circuit, as well as an optical circuit, is desirably formed in at least one of the above-described flex portions.
[0035]In the device for optical communication according to the first aspect of the present invention, desirably, there are a plurality of the above-described flex portions, and an optical circuit and/or a conductor circuit are/is formed in each of the flex portions. Of the above-described flex portions, desirably, at least one flex portion comprises an optical circuit out of the optical circuit and the conductor circuit, and at least another flex portion comprises a conductor circuit out of the optical circuit and the conductor circuit.
[0036]In this case, a flex portion in which an optical circuit is desirably formed and a flex portion in which a conductor circuit is formed are formed in the same layer.
[0037]In the device for optical communication according to the first aspect of the present invention, desirably, a conductor circuit is formed in the above-described flex portion, and a portion or the entirety of a conductor circuit that is formed in the above-described flex portion is of a power supply pattern and/or a ground pattern.
[0038]In the device for optical communication according to the first aspect of the present invention, a cover lay is desirably formed in an outermost layer on at least one side of the above-described flex portion.
[0039]In the device for optical communication according to the first aspect of the present invention, the above-described optical circuit is desirably an optical waveguide in film form.
[0040]Then, in the above-described flex portion, desirably, a conductor circuit functioning as a signal pattern or a power supply pattern is formed on one side of a substrate, and a conductor circuit functioning as a ground pattern is formed on the other side of the above-described substrate, and the above-described optical waveguide is formed on the above-described conductor circuit functioning as a ground pattern.
[0041]In addition, in the above-described flex portion, desirably, a conductor circuit functioning as a signal pattern is formed on one side of a substrate, and a conductor circuit functioning as a ground pattern or a power supply pattern is formed by interposing an insulating layer, and a conductor circuit functioning as a ground pattern is formed on the other side of the above-described substrate, and the above-described optical waveguide is formed on the above-described conductor circuit functioning as a ground pattern.
[0042]In addition, in the above-described flex portion, desirably, a conductor circuit with differential line functioning as a signal pattern is formed on one side of a substrate, and a conductor circuit functioning as a ground pattern or a power supply pattern is formed on the other side of the above-described substrate, and the above-described optical waveguide is formed on the above-described conductor circuit functioning as a ground pattern.
[0043]The device for optical communication according to the first aspect of the present invention is desirably used for a cellular phone, a personal computer, a digital video camera, a digital camera, a CCD module, a liquid crystal panel, or an optical conversion module.
[0044]In the device for optical communication according to the first aspect of the present invention, a RGB signal is desirably transmitted via an optical circuit, and a screen adjusting signal is transmitted via a conductor circuit.
[0045]A device for optical communication according to a second aspect of the present invention comprises a photoelectric circuit board where a rigid portion where at least a conductor circuits and an insulating layer are formed and layered and one or more flex portions that are bendable are integrated, wherein an optical signal transmitting region and external connection portions for mounting an optical element and/or a package substrate on which an optical element is mounted are formed, and the above-described optical signal transmitting region is formed in the above-described rigid portion, the above-described optical element and/or the above-described package substrate are connected to the above-described external connection portions, an optical circuit is formed in at least one of the above-described flex portions, and the above-described optical circuit are optically coupled with and one end of the above-described optical signal transmitting region of the above-described rigid portion.
[0046]In the rigid portion of the device for optical communication according to the second aspect of the present invention, a conductor circuit and an insulating layer are desirably formed and layered on both sides of a substrate.
[0047]In the device for optical communication according to the second aspect of the present invention, the above-described optical signal transmitting region is desirably filled in with a resin composite or formed only of an opening.
[0048]In the device for optical communication according to the second aspect of the present invention, the above-described optical signal transmitting region is desirably formed so as to penetrate through the above-described substrate and all the above-described insulating layers that configure the above-described rigid portion or so as to penetrate only through the above-described substrate and a portion of the above-described insulating layers that configure the above-described rigid portion.
[0049]In the device for optical communication according to the second aspect of the present invention, the above-described optical signal transmitting region desirably has a collective through hole structure or an individual through hole structure.
[0050]In the device for optical communication according to the second aspect of the present invention, the above-described resin composite desirably has about 70%/mm or more of transmittance of a transmission light.
[0051]In the device for optical communication according to the second aspect of the present invention, a microlens is desirably provided on an end portion on the side opposite to the side where the above-described optical signal transmitting region is optically coupled with an optical circuit.
[0052]Here, the above-described microlens desirably has about 70%/mm or more of transmittance of a transmission light.
[0053]In the device for optical communication according to the second aspect of the present invention, the above-described microlens is desirably provided directly or by interposing optical adhesive.
[0054]In addition, the above-described microlens is desirably provided by interposing a lens marker.
[0055]In the device for optical communication according to the second aspect of the present invention, the above-described optical circuit is desirably an optical waveguide where an optical path conversion mirror is formed.
[0056]In the device for optical communication according to the second aspect of the present invention, an optical path conversion member is desirably provided in the above-described photoelectric circuit board.
[0057]Here, the above-described optical path conversion member is desirably fixed to the above-described optical element.
[0058]In addition, the above-described optical path conversion member is desirably provided on the above-described photoelectric circuit board by interposing a submount substrate.
[0059]In addition, the above-described optical path conversion member is desirably fixed to the wall side of the above-described optical signal transmitting region by interposing an adhesive.
[0060]In the device for optical communication according to the second aspect of the present invention, an optical path conversion mirror is desirably formed in the above-described optical path conversion member.
[0061]In addition, a convex lens or a grating lens is desirably formed on a reflective side of the above-described optical path conversion member.
[0062]In the device for optical communication according to the second aspect of the present invention, desirably, using an optical adhesive layer, an optical path conversion member is fixed on the side opposite to the side of the above-described submount substrate where an optical element is mounted, and the above-described submount substrate is mounted on the above-described photoelectric circuit board by interposing solder.
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