Tire Temperature Measuring

The Formula UFSM team participates annually in the Formula SAE Brazil competition, an event dedicated to the development of open-wheel racing prototypes. Each season, our primary objective is to enhance the vehicle's performance, tackle new technical challenges, and secure 1st place overall.

Image 1: FU-20 Prototype during a Acceleration test.

One of the key projects driving this evolution is the embedded TTSU (Tire Temperature Sensing Unit), a system designed to monitor the tire tread temperature and assist in analyzing the car's dynamic performance on the track.

The implementation of this project involves two PCBs:

Control Unit PCB:

This board features a microcontroller integrated with an Arduino module, responsible for processing sensor data and managing communication with other system components. An integrated CAN module enables data transmission to the prototype's ECU.

Image 2: PCB for Arduino Interface.

Sensor Interface PCB:

This board is dedicated to connecting and mounting the infrared sensors that measure tire temperatures. These sensors communicate with the microcontroller using the I2C protocol. Positioned at three equidistant points relative to the tire, the sensors divide the tread into zones for precise temperature measurement.

Image 3: PCB for sensor mounting.