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Stackup for 22-layer 4-order Rogers High-frequency HDI PCB

by: May 23,2024 1028 Views 0 Comments Posted in PCB Design & Layout

HDI PCB Rogers HF Aspect Ratio Stackup

PCBWay, as a leading manufacturer of high-complexity HDI PCBs, not only possesses the capability to develop and manufacture HDI PCB with FR4 with more than 5-order, high-speed, or high-frequency materials, but also has the ability to produce specialized products, such as PCBs with ultra-high layer count and high-frequency.

Next, let's take a look at the product information of PCBWay's latest 22-layer 4-order Rogers high-frequency HDI PCB with pure lamination and ultra-high aspect ratio.

Stack-Up and Parameter Overview

22 Layer HDI PCB Stackup

Parameter Overview

Number of Layers: 22

Board Thickness: 6.9mm

Minimum Hole Diameter: 0.45mm

Number of Laminations: 5

Via Process: vias filled with resin

Aspect Ratio: 15:1

Impedance: 50Ω ± 3Ω

Trace Width/Spacing: 4mil/4mil

BGA Diameter: 8mil (16 groups), each group corresponding to 12 RF trace

Application Fields and Frequency Bands

• Application Fields: 5G Base Station

• Frequency Bands: 26GHZ

Product Photos

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