PCBWay, as a leading manufacturer of high-complexity HDI PCBs, not only possesses the capability to develop and manufacture HDI PCB with FR4 with more than 5-order, high-speed, or high-frequency materials, but also has the ability to produce specialized products, such as PCBs with ultra-high layer count and high-frequency.
Next, let's take a look at the product information of PCBWay's latest 22-layer 4-order Rogers high-frequency HDI PCB with pure lamination and ultra-high aspect ratio.
• 22 Layer HDI PCB Stackup
• Parameter Overview
Number of Layers: 22
Board Thickness: 6.9mm
Minimum Hole Diameter: 0.45mm
Number of Laminations: 5
Via Process: vias filled with resin
Aspect Ratio: 15:1
Impedance: 50Ω ± 3Ω
Trace Width/Spacing: 4mil/4mil
BGA Diameter: 8mil (16 groups), each group corresponding to 12 RF trace
• Application Fields: 5G Base Station
• Frequency Bands: 26GHZ
