Dear Sirs,
We are currently in the advanced design phase of a PCB project and are evaluating manufacturing and assembly options. We are considering using your services for both fabrication and assembly.
Please find attached the current layer stack-up of our board. The dielectric material used is FR408HR, which we selected for its performance in high data rate applications. Based on this, we would like to ask the following:
Could you provide your preferred layer stack-up recommendation for FR408HR or similar high-speed material, based on the attached configuration?
What is the lead time for FR408HR material with your process?
Do you foresee any constraints or adjustments required from your side, especially regarding impedance control or via design?
We look forward to your feedback, especially regarding material availability and compatibility with your standard processes. Once the stack-up is confirmed, we will be happy to proceed further and discuss assembly details as well.
Thank you in advance for your support.