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Copper Coin-Embedded PCB for Heat Dissipation | PCB Knowledge

by: Jul 03,2023 4091 Views 0 Comments Posted in PCB Basic Information

Embedded copper coin thermal management

Common PCB thermal management methods include using a heat sink, thermal pads, thermal vias, copper pour, and thermal relief. In PCB designs, thermal management methods can be implemented using a combination of single or multiple techniques. For example, a PCB design might include heat sinks attached to hot components, thermal vias for heat conduction, copper pours to spread heat, and proper component placement to optimize airflow. However, in situations where the available surface areas are limited, heat management can be addressed by incorporating embedded copper structures.

What is Embedded Copper Technology?

Embedded copper technology is a technique used to integrate solid copper into the PCB layers. Copper, being an excellent conductor of heat, acts as a heat sink to enhance heat dissipation. It is particularly beneficial when placed beneath high-power components. Unlike other materials with decent thermal conductivity, such as aluminum or ceramics, copper possesses a unique combination of exceptional thermal and electrical conductivity. Embedded copper is widely used in power electronics, automotive, aerospace, and telecommunications, where reliable heat management is crucial.

Working Principle of Embedded Copper

The embedded copper coin, known for its excellent heat conductivity, facilitates the efficient transfer of heat from the component to the PCB. Acting as a thermal bridge, the copper coin quickly conducts the heat away from the component and transfers it into the PCB. Once within the PCB, the heat is distributed across its surface area, allowing for effective dissipation into the surrounding environment.

Types of Embedded Copper

Buried copper coins are copper structures that are integrated within the inner layers of a printed circuit board. These coins have a thickness less than the total thickness of the board. While embedded copper coins can be placed either on the surface or within the layers of a printed circuit board. When positioned on the surface, these copper coins are visibly present. Alternatively, they can be strategically embedded within the layers of the PCB. In both configurations, embedded copper coins serve to establish direct thermal pathways and electrical connections between different layers of the PCB, promoting efficient heat dissipation and facilitating electrical conductivity.

Potential Drawbacks

The implementation of embedded copper structures may add complexity to the PCB manufacturing process, impact the available space for routing traces and components, and increase costs. Therefore, when arranging your PCB layout, it's crucial to carefully weigh these advantages and drawbacks to determine if embedded copper is the most suitable choice for your thermal management needs.


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