I just received my first PCB from PCBWay. What is the allowed manufacturing error in centering the solder mask with the pads? I have enclosed a view of a VSSOP (pads 0.3mm x 0.8mm) IC on that board and the offset between the pad centre and the mask opening centre is just under 0.09mm. This results in an overlap of the pad of about 16%. I don't expect any problems in assembly, but for future work I need to know how big this offset can be before the board would be rejected by PCBWay.
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