I would like to ask for detailed information(exact metal composition) regarding your PCB surface finish options, Immersion Gold (ENIG) and Selective Hard Gold.
1) Immersion Gold (ENIG)
a. Exact layer structure (Cu / Ni / Au)
b. Typical Au thickness and Ni thickness
c. Whether the immersion gold layer is pure Au
d. Typical porosity/pinhole characteristics of the Au layer
2) Hard Gold / Selective Hard Gold
a. Exact layer structure
Whether the hard gold contains cobalt, nickel, or other alloying elements, or if it is pure gold
b. Approximate alloy composition (%)
c. Whether selective hard gold can be applied specifically to electrode pad regions only
3) Compatibility with Additional Electroplating
Could you give an advise of whether your hard gold surface or Immersion gold surface is suitable as a seed layer for additional Au electroplating.
Thank you very much for your help.
