Hex6 RevA first-article — capability confirmation before order

Engineer asked Oct 08,2026
1

Board: 84.5 × 129.5 mm, 4-layer, 2 oz

finished copper on ALL layers, ENIG, lead-

free. Design minima: 0.2 mm (8 mil) trace/

space, 0.4 mm drill vias, no HDI/blind/

buried. 648 drill hits.


Assembly: 6 × BM1366 positions present on

the PCB but intended to be LEFT BARE on

this first order — we populate

incrementally (one chip, then five).

Please confirm this is acceptable as

stated in Q7. Fitted: 1× TPS546D24ARVFR

QFN-40 0.5 mm pitch with exposed thermal

pad + via-in-pad, 0402/0603/0805 jellybean,

TSSOP-16/14, TSOT-23-5, 3225 oscillators.

R1/R3/R7 are DNP (already removed from CPL)

. J5/J6/HS1/fans not placed by you.


Please confirm IN WRITING before we place

the order:


1. 4-layer, 2 oz ext+int stack as

specified — acceptable, no surcharge

blocker?

2. Leadless-QFN/BGA assembly capability

for the above pitches + lead-free

reflow + X-ray on a 30-pad leadless

BM1366 first article — confirmed? (

Applies to Q7's optional single-chip

variant below.)

3. 0.2 mm trace/space and 0.4 mm drill

vias held — confirmed?

4. Soldermask web at U3 pads 37/41 corner (

tight web, documented in U3 review,

copper accepted as-is): will you

inspect first article and report ratherthan edit copper? Confirmed?

5. Controlled drill/plating for 0.4 mm

signal vias + SW NPTH — confirmed?

6. BOM-critical parts (TPS546D24A,

inductors L1/L2 MPNs, ESP32-S3 module):

sourced as listed, or state substitutes

for approval BEFORE swapping. Agreed?

7. Population strategy. We intend order 1

to arrive with the six BM1366 positions

BARE (all other parts fitted), then

populate one chip ourselves and return/

assemble the remaining five later.

Confirm: (a) bare ASIC positions

acceptable on this order; (b) do you

offer a partial-population variant

where you fit exactly 1 × customer-

supplied BM1366 and leave five bare,

with X-ray on that one — and at what

cost/lead-time difference vs. bare; (c)

can a follow-up order be placed later

for the remaining five without a new

NRE?

8. First-article inspection commitment:

paste/reflow check at U3 37/41 + X-ray

sample report shared with customer.

Agreed?

9. If we self-populate the BM1366 (Q7a),

do you supply or recommend a stencil/

land pattern, and what do you require

for voiding under a 30-pad leadless

package on a 2 oz board?


Please reply point-by-point (1–9). A "yes

with notes" is acceptable; any "no" must

state the required change so we can ECO

before ordering.

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