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The assembly quality was equally impressive, especially considering the added thermal mass of the copper-backed board. Components were placed accurately and aligned neatly, with clean solder joints and no visible bridging, excess residue, or rework marks. The soldering appeared uniform across both small components and larger thermal or power-related parts, suggesting careful temperature control during assembly. The completed boards arrived clean, well packaged, and ready for testing, giving strong confidence in both the fabrication and assembly workmanship.
Jun 04,2026
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