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Radomir Radev
Radomir Radev pic
Fail Safe Add On
PCB review comments are highly positive, highlighting clean routing, well-balanced power distribution, and strong signal integrity. Component placement is organized and efficient, improving thermal pe...
Radomir Radev
Radomir Radev pic
NERM V5
PCB review comments are highly positive, highlighting clean routing, well-balanced power distribution, and strong signal integrity. Component placement is organized and efficient, improving thermal pe...
Radomir Radev
Radomir Radev pic
barpwr2a
PCB review comments are highly positive, highlighting clean routing, well-balanced power distribution, and strong signal integrity. Component placement is organized and efficient, improving thermal pe...
Radomir Radev
Radomir Radev pic
Front Board
PCB design for a Front Board focuses on clear interface functionality, stable signal routing, and reliable user interaction. Proper component placement ensures accessibility, while grounding and shiel...
Radomir Radev
Radomir Radev pic
Encoder
PCB design for an encoder focuses on precise signal generation, noise immunity, and stable rotational feedback. Controlled impedance traces, proper grounding, and shielding reduce interference. Accura...
Radomir Radev
Radomir Radev pic
Bargraph FRONT board
PCB design for a Bargraph FRONT board prioritizes clear visual output, stable LED control, and minimal signal distortion. Optimized trace routing and balanced current paths ensure uniform illumination...
Radomir Radev
Radomir Radev pic
Pilot Wire Monitor
PCB design for a Pilot Wire Monitor emphasizes reliable fault detection, stable signal processing, and noise immunity. Isolated routing, proper shielding, and accurate component placement ensure depen...
Radomir Radev
Radomir Radev pic
FaciaV3 NEW
Stack-up definition, dielectric properties, copper thickness, trace impedance, via types, thermal reliefs, solder mask, silkscreen, ground plane continuity, power distribution, return paths, EMI contr...
Radomir Radev
Radomir Radev pic
Mini Sig B
PCB review comments are highly positive, highlighting clean routing, well-balanced power distribution, and strong signal integrity. Component placement is organized and efficient, improving thermal pe...
Radomir Radev
Radomir Radev pic
THVC25
PCB review comments are highly positive, highlighting clean routing, well-balanced power distribution, and strong signal integrity. Component placement is organized and efficient, improving thermal pe...
Radomir Radev
Radomir Radev pic
Rear Board
PCB design for a Rear Board emphasizes dependable connectivity, stable power distribution, and clean signal management. Proper grounding and shielding reduce interference, while well-aligned connector...
Radomir Radev
Radomir Radev pic
BOTTOM board
PCB design for a BOTTOM board emphasizes structural stability, reliable interconnection, and clean signal distribution. Proper grounding, controlled trace routing, and well-placed connectors ensure de...
Radomir Radev
Radomir Radev pic
Bargraph REAR board
PCB design for a Bargraph REAR board emphasizes dependable LED drive support, clean signal routing, and strong mechanical stability. Proper grounding and connector positioning ensure accurate communic...
Radomir Radev
Radomir Radev pic
Bargraph BOTTOM
PCB design for a Bargraph BOTTOM module focuses on stable LED driving, uniform illumination, and reliable current regulation. Proper trace routing, thermal management, and grounded reference paths ens...
Radomir Radev
Radomir Radev pic
THVC Input Card
PCB design for a THVC Input Card focuses on handling high-voltage signals safely and accurately. It requires reinforced insulation, controlled creepage distances, and robust grounding. Precision routi...
Radomir Radev
Radomir Radev pic
PEFTX3101
Stack-up definition, dielectric properties, copper thickness, trace impedance, via types, thermal reliefs, solder mask, silkscreen, ground plane continuity, power distribution, return paths, EMI contr...
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