Hi
We need to design a PCB with a 300um pitch BGA component. Please have a look at the attached image showing the footprint of the component.
Question:
What approach do you suggest to fan out all signals, what PCB specifications do we need?
PCB specifications:
- Number of layers: 4
- Thickness: 1 mm
- Blind vias: yes
- Via in pad: yes
- Dimensions: 25 x 28 mm
Thanks for your help & best regards
Rashid
