Hello, I'd like to know if it were possible to manufacture a 4-layer hybrid layer using the same stackup as in https://www.multi-circuit-boards.eu/fileadmin/pdf/leiterplatten_lagenaufbau/Multi-CB_Definierter_Lagenaufbau-Hybrid_Impedanzen_en.pdf (figure Type 4L-H01), but instead of using 168um for RO4350B, using 150um.
Thx in advance.