Sir, we have 4 layers PCB
we are using 0.4mm pitch size, 0.27mm ball size 6x6 BGA IC in our PCB layout
as per PCB capabilities, it suggests that 0.1mm clearance, 0.5mm via (0.2mm drill inside via)
can you please guide us for DRC rules for 0.4mm pitch size BGA IC? Also, can we place via on the pad?
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 5 |
| 2 | Mason Goebel | 1 |
| 3 | Engineer | 1 |
