PCB Prototype the Easy Way
Full feature custom PCB prototype service.
At least 95% shipping on-time!
Smart TV Box Pro Board PCB Assembly
Flex PCB Assembly Services
Digital Processor PCB Assembly
Rigid Flex PCB Assembly
We are a one-stop shop for all your PCB
assembly needs:Partial Turn-Key PCBA,
Full Turn-Key PCB Assembly,PCB Manufacturing.
Fast speed and the Original Components,
we have cost advantages.
On-site PCB Assembly - protects your design
Prototype and small volume PCB assembly
Just like PCB business, our PCBA services also specialize in prototyping and small-volume production, making PCBWay the one-stop destination of boards fabrication and assembly. This arrangement makes your R&D work easy and time-saving. Our professional engineers and technicians will work closely with you through our customer service people to ensure the best quality and quickest possible lead time. Fulfilling hundreds of orders daily from around the world, we have established us as the leading supplier of PCB and PCBA services for our consistent quality and excellent services.
PCBWay PCBA capabilities: SMT Assembly, BGA Assembly, Through-Hole Assembly, Mixed Assembly, Rigid Flex PCB Assembly Services.Compliant with a wide range of standards including IPC 610 Class 2 and Class 3.
SMT Assembly -- Components are mounted by placing them directly onto the PCB's surface. We have the capabilities to assemble
SMT prototype PCBs in small production runs with manual and/or automated SMT production processes, including single- or
double-sided component insertions. Our production facilities can assemble the following SMT types:
• Ball Grid Array (BGA)
• Ultra-Fine Ball Grid Array (uBGA)
• Quad Flat Pack No-Lead (QFN)
• Quad Flat Package (QFP)
• Small Outline Integrated Circuit (SOIC)
• Plastic Leaded Chip Carrier (PLCC)
• Package-On-Package (PoP)
• Small Chip Packages (pitch of 0.2 mm)
Four automated placement systems available with Vision Systems capable of inspecting solder ball coverage. One automated
systems available with 3-D laser capable of inspecting solder ball height Automatic placement of CBGA, PBGA and MBGA
Verification of BGA’s using Phoenix real-time x-ray system. Ball Grid Array (BGA) style circuit boards, which used small circular balls
of solder to allow the flow of electricity between parts of the circuit. This brought with it a number of advantages to PCB assembly:
Higher-density circuits: As through-hole circuits were more densely-populated,
soldering them accurately without crossover or short-circuits became nearly
impossible. Heat conduction: BGA circuits allow heat to pass much more easily
from the integrated circuit outwards, reducing overheating problems. Lower
inductance: Because each solder ball in an BGA circuit is generally only a
handful of millimeters large, problems from interference within the circuit are
Through-Hole Assembly -- Components are mounted by inserting leads into holes which are then covered by solder.
Automated Through-Hole Assembly Manual Through-Hole Assembly
We had traditional through-hole circuitry, with leads being directly threaded through pre-made
holes in the printed circuit board. This was simple enough to be done by hand, but Ball Grid
Array (BGA) PCB extremely inefficient in terms of optimizing space usage.
Through-hole mounting techniques are now usually reserved for bulkier or heavier components
such as electrolytic capacitors or semiconductors in larger packages such as the TO220 that
require the additional mounting strength, or for components such as plug connectors or
electromechanical relays that require great strength in support.
Mixed Assembly -- Through-Hole, SMT and BGA components are housed on the PCB.
Single- or double-sided mixed technology or SMT (Surface Mount) for PCB assembly Single- or double-sided BGA and micro-BGA
installation and rework with 100% X-ray inspection
PCB board components, including all types of BGAs, QFNs, CSPs, 0201, 01005,
POP, and Pressfit Components in small quantities
Part Polarity Capacitors, SMT Polarized Capacitors, and Through-Hole Polarized
Rework Capabilities: Removing & Replacing BGA’s & MBGA’s, Experienced with
Ceramic & Plastic BGA’s, Reballing BGA’s & MBGA.
|No.||Types Of Assembly||File Format||Component Footprinr||Component Package||Testing Produres||Produres||Others|
|1||SMT ASSEMBLY||Gerber RS-274X||0201,0402,0603...||Reels Package||Visual Inspection||Lead-Free(Rohs)||Custom Reflow Profile|
|2||SMT & THT Assembly||BOM(.xls,.csv,.xlsx)||BGA,QFN,QFP,PLCC||Cut Tape Package||X-Ray Inspection||Leaded Solder||Standard Reflow Profile|
|3||2 sided STM,THT Assembly||Pick-N-Place/XY file||SOIC,POP...Connectors||Tube and Tray||AOI,ICT(In-Circuit Test)||Reflow Soldering||Smallest Size:0.2"x0.2"|
|4||Mixed Assembly||...||Small Pitch of 8 Mils||Loose parts and bulk||Functional Testing||Wave Soldering||Largest Size:15"x"20|