PCB Prototype the Easy Way

Full feature custom PCB prototype service.

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Example printed circuit boards manufactured by us.

We have the PCB manufacturing capabilities to build simple to complex bare boards.
Please review the example printed circuits below and let us know if you have any
questions or would like a formal quote.

Focus on high-end PCB design, R&D, production, sales, provide customers with high-level, high-speed, high-frequency, high-end,
high-density, high-difficulty HDI PCB design and other types of PCB proofing, customization, board manufacturing and bulk online
order purchase service. The products have covered high-end HDI buried blind hole PCB, 5G communication PCB board, high frequency
and high speed PCB, optical module PCB, semiconductor test, aerospace PCB circuit board and many other fields.

  • Semiconductor test PCB

    8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm

  • 5G Internet of Things PCB

    8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm

  • 5G signal test PCB

    4 layers, Material: RO4350B+TU768, Thickness: 1.6mm

  • 5G mobile phone PCB motherboard

    12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

  • Mobile phone 3rd-order HDI board

    12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

  • Automotive communication 2nd-order HDI board

    14 layers, Thickness: 1.6±0.16, Surface Finish: OSP

  • Industrial control 5th-order HDI board

    12 layers, Material: S1000-2M, Thickness: 1.8±0.18mm

  • Semiconductor test 4th-order HDI board

    8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm

  • Ipad 3rd-order HDI board

    8 layers, Material: S1000-2M, Thickness: 1.2±0.1mm

  • 10-layer 2nd-order HDI board

    10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm

  • 6th-order arbitrary interconnection HDI buried/blind via circuit board

    14 layers, Material: S1000-2M, Thickness: 1.6±0.1mm

  • 4th-order HDI buried/blind via board

    10 layers, Material: S1000-2M, Thickness: 2.2±0.2mm

  • 3rd-order HDI board

    8 layers, Material: A1000-2M, Thickness: 2.5±0.25mm

  • 3rd-order HDI PCB buried resistor circuit board

    8 layers, Material: R5775G+IT180, Thickness: 2.0±0.2mm

  • 3rd-order 5G IoT HDI PCB

    8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm

  • 2nd-order high speed PCB

    18 layers, Material: RO4350B+TU872SLK Rogers, Thickness: 3.2±0.32mm

  • 2nd-order HDI buried/blind via board

    22 layers, Material: TU-883, Thickness: 1.6±0.16mm

  • 2nd-order HDI test board

    10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm

  • PCB Design and Layout

    PCB design file errors and solutions

  • FPC/R-FPC

    Flexible Part Circuit Design Requirements

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