PCBWay Mid Year Big Sale and 6th Anniversary Celebration 2020

Stencil design for BGA components in Eagle. should I disable the tCream layer for this package?

Andrew asked Jul 08,2020

Hi all,

I'm working on a design that uses a power switch(picture showed below) with a 6-UFBGA package to switch between USB and battery backup power. I will be placing the components by hand and using a stencil, solder paste and reflow oven to make the connections. Given that the pins themselves are balls of solder, should I disable the tCream layer for this package so the cutouts don't show up in the stencil and solder paste won't get deposited over the pads?


  • Your Answer(2)
You can only upload 1 files in total. Each file cannot exceed 2MB. Supports JPG, JPEG, GIF, PNG, BMP

Your professional answers would kindly help others and you will get a reward with PCBWay Beans.

    View More
    Browse other questions tagged or ask your own question.
    Ranking Name Answers
    1 Remy 11
    2 Li Zhuo 9
    3 Paul H 9
    4 Kemio 6
    5 PCBWay Support 5
    6 Gorge 4
    7 Andrew 4
    8 Joson 4
    9 HomeKid 3
    10 Carl 2