Hi all,
I'm working on a design that uses a power switch(picture showed below) with a 6-UFBGA package to switch between USB and battery backup power. I will be placing the components by hand and using a stencil, solder paste and reflow oven to make the connections. Given that the pins themselves are balls of solder, should I disable the tCream layer for this package so the cutouts don't show up in the stencil and solder paste won't get deposited over the pads?
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| 2 | sisma | 1 |
| 3 | Tormy Van Cool | 1 |
| 4 | Julian Phillips | 1 |
