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Stencil design for BGA components in Eagle. should I disable the tCream layer for this package?

Andrew asked Jul 08,2020
0

Hi all,

I'm working on a design that uses a power switch(picture showed below) with a 6-UFBGA package to switch between USB and battery backup power. I will be placing the components by hand and using a stencil, solder paste and reflow oven to make the connections. Given that the pins themselves are balls of solder, should I disable the tCream layer for this package so the cutouts don't show up in the stencil and solder paste won't get deposited over the pads?

400.jpg

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