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Board Type :
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Single PCB
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GerberFile :
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W141064ASZ...ur MOSFETS).zip
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Size :
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60.4 x 135.1
mm
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Material :
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FR-4 TG130
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Layers :
|
2
layers
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Thickness :
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1.6
mm
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|
Min Track/Spacing :
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8/8mil
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Min Hole Size :
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0.3 mm
|
|
Edge connector :
|
Bevelling:
Thickness of Immersion Gold:
Au/Ni thickness: AU: 10U"/Ni:120U"
Thickness of ENEPIG： Ni:200U"/Pd:2U"
/Au:2U"
|
Surface Finish :
|
Thickness of Immersion Gold:
Au/Ni thickness: AU: 5U"/Ni:120U"
Thickness of ENEPIG： Ni:200U"/Pd:2U"
/Au:2U"
Thickness of Immersion gold：U"
Au/Ni thickness: AU: 5U"/Ni:120U"
Immersion gold : U", Hard gold : Au:5U"/Ni:120U"
|
|
Via Process :
|
Tenting vias
|
Finished Copper :
|
2 oz Cu
|
|
Solder Mask :
|
|
Silkscreen :
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UV printing Multi-color (beta):
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Quantity :
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|
Build Time :
|
|
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Other special request :
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