Japan Noda Screen (strains) for research and development within the printed circuit board components buried thin film capacitor will be in April 2009, and pilot production of products into the market.
Electronic components will be embedded printed circuit boards are entering practical application stage, as a printed circuit board within the buried components, Noda Screen companies STO (strontium titanate), BST (Barium strontium titanium), BTO (BaTiO3) , and other inorganic medium processed into about 200 nm thickness of thin film capacitors.
Production technology is used in aerosol CVD (chemical vapor deposition) plot of the film made capacitance.
As a result of this CVD technology can be suspended particles in the atmosphere under vacuum without the need for film containers, equipment cheaper in the film can be controlled under the conditions of crystallization rate, there is dense film, but also by the use of a uniform liquid aerosol composition will not happen so easy to change the composition of control.
Looking forward to this plot of the film capacitor application of a more appropriate components buried in the plot of the multi-storey printed circuit boards.
