The Formation and Prevention of Black Pad and Phosphorus-Rich Layers

In our daily SMT soldering operations, we often find that ENIG surface-treated boards are prone to two fatal problems: nickel corrosion and phosphorus-rich layers. Once such problems occur, they often cause a lot of batch solder joint reliability problems. Because these two types of problems are very concealed, the current reproduction is generally not easy to detect. Once found, most of them are too late. The damage and losses have already been caused and may not be able to make up.There are ba...

ENIG SMT phosphorus-rich layer black pad

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