BGA Soldering Quality Detection Techniques by X-Ray Imaging

Introduction:BGA is a typical high-density packaging technology. Its characteristics are that the chip pins are distributed under the package in the form of spherical solder joints, which can make the device smaller, more pins, larger pin spacing, higher assembly rate of finished products and better electrical performance. Thus, the application of this kind of packaging method is more and more popular with the market.Currently, BGA soldering quality detection methods are very limited. Common det...


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